Books > Professional & Technical > Mechanical engineering & materials > Production engineering
|
Not currently available
Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing (Hardcover)
Loot Price: R2,780
Discovery Miles 27 800
You Save: R243
(8%)
|
|
Modeling and Simulation for Microelectronic Packaging Assembly - Manufacturing, Reliability and Testing (Hardcover)
Supplier out of stock. If you add this item to your wish list we will let you know when it becomes available.
|
Although there is increasing need for modeling and simulation in
the IC package design phase, most assembly processes and various
reliability tests are still based on the time consuming "test and
try out" method to obtain the best solution. Modeling and
simulation can easily ensure virtual Design of Experiments (DoE) to
achieve the optimal solution. This has greatly reduced the cost and
production time, especially for new product development. Using
modeling and simulation will become increasingly necessary for
future advances in 3D package development. In this book, Liu and
Liu allow people in the area to learn the basic and advanced
modeling and simulation skills to help solve problems they
encounter. * Models and simulates numerous processes in
manufacturing, reliability and testing for the first time *
Provides the skills necessary for virtual prototyping and virtual
reliability qualification and testing * Demonstrates concurrent
engineering and co-design approaches for advanced engineering
design of microelectronic products * Covers packaging and assembly
for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano
interconnects * Appendix and color images available for download
from the book's companion website Liu and Liu have optimized the
book for practicing engineers, researchers, and post-graduates in
microelectronic packaging and interconnection design, assembly
manufacturing, electronic reliability/quality, and semiconductor
materials. Product managers, application engineers, sales and
marketing staff, who need to explain to customers how the assembly
manufacturing, reliability and testing will impact their products,
will also find this book a critical resource. Appendix and color
version of selected figures can be found at
www.wiley.com/go/liu/packaging
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
You might also like..
Techlash
Ian I. Mitroff, Rune Storesund
Hardcover
R1,322
Discovery Miles 13 220
See more
|
Email address subscribed successfully.
A activation email has been sent to you.
Please click the link in that email to activate your subscription.