TSV 3D RF Integration - High Resistivity Si Interposer Technology (Paperback)

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

General

Imprint:	Elsevier - Health Sciences Division
Country of origin:	United States
Release date:	April 2022
First published:	2022
Authors:	Shenglin Ma • Yufeng Jin
Dimensions:	235 x 191mm (L x W)
Format:	Paperback
Pages:	292
ISBN-13:	978-0-323-99602-0
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
LSN:	0-323-99602-7
Barcode:	9780323996020

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