This book is a comprehensive SiP design guide book. It is divided
into three parts: concept and technology, design and simulation,
project and case, for a total of 30 chapters. In Part one, the
author proposes some new original concepts and thoughts, such as
Function Density Law,Si³P and 4D integration. Part one also covers
the latest technology of SiP and Advanced Packaging. Part
two covers the latest SiP and Advanced Packaging design and
simulation technologies, such as wire bonding, multi-step cavity,
chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip,
Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D
SiP design, Multi-layout project and Team design, as well as SI,
PI, thermal simulation, electrical verification and physical
verification. Based on a real design case, part three
introduces the design, simulation and implementation methods of
different types of SiP, which has a -important reference
significance for the research and development of SiP
projects. This book comprehensively and deeply expounds the
latest development, design ideas and design methods of contemporary
SiP technology from three aspects: concept and technology, design
and simulation, project and case. Through the detailed
introduction of new concepts, design methods, actual projects and
cases, this book describes the whole process of SiP products from
the beginning of conception to the final realization and makes
readers benefit from it.
General
| Imprint: |
Springer Verlag, Singapore
|
| Country of origin: |
Singapore |
| Release date: |
May 2023 |
| First published: |
2022 |
| Editors: |
Suny Li
|
| Dimensions: |
235 x 155mm (L x W) |
| Pages: |
874 |
| Edition: |
1st ed. 2022 |
| ISBN-13: |
978-981-19-0085-3 |
| Categories: |
Books
Promotions
|
| LSN: |
981-19-0085-X |
| Barcode: |
9789811900853 |
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