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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors

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MicroSystem Based on SiP Technology (Hardcover, 1st ed. 2022) Loot Price: R5,350
Discovery Miles 53 500
MicroSystem Based on SiP Technology (Hardcover, 1st ed. 2022): Suny Li

MicroSystem Based on SiP Technology (Hardcover, 1st ed. 2022)

Suny Li

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Loot Price R5,350 Discovery Miles 53 500 | Repayment Terms: R501 pm x 12*

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This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si(3)P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

General

Imprint: Springer Verlag, Singapore
Country of origin: Singapore
Release date: June 2022
First published: 2022
Editors: Suny Li
Dimensions: 235 x 155mm (L x W)
Format: Hardcover
Pages: 874
Edition: 1st ed. 2022
ISBN-13: 978-981-19-0082-2
Categories: Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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LSN: 981-19-0082-5
Barcode: 9789811900822

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