This book is a comprehensive SiP design guide book. It is divided
into three parts: concept and technology, design and simulation,
project and case, for a total of 30 chapters. In Part one, the
author proposes some new original concepts and thoughts, such as
Function Density Law,Si(3)P and 4D integration. Part one also
covers the latest technology of SiP and Advanced Packaging. Part
two covers the latest SiP and Advanced Packaging design and
simulation technologies, such as wire bonding, multi-step cavity,
chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip,
Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D
SiP design, Multi-layout project and Team design, as well as SI,
PI, thermal simulation, electrical verification and physical
verification. Based on a real design case, part three introduces
the design, simulation and implementation methods of different
types of SiP, which has a -important reference significance for the
research and development of SiP projects. This book comprehensively
and deeply expounds the latest development, design ideas and design
methods of contemporary SiP technology from three aspects: concept
and technology, design and simulation, project and case. Through
the detailed introduction of new concepts, design methods, actual
projects and cases, this book describes the whole process of SiP
products from the beginning of conception to the final realization
and makes readers benefit from it.
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