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Books > Children's & Educational > Language & literature > English (including English as a school subject) > English language > English language readers

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Nanoparticle Engineering for Chemical-Mechanical Planarization - Fabrication of Next-Generation Nanodevices (Paperback) Loot Price: R1,798
Discovery Miles 17 980
Nanoparticle Engineering for Chemical-Mechanical Planarization - Fabrication of Next-Generation Nanodevices (Paperback): Ungyu...

Nanoparticle Engineering for Chemical-Mechanical Planarization - Fabrication of Next-Generation Nanodevices (Paperback)

Ungyu Paik, Jea-Gun Park

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Loot Price R1,798 Discovery Miles 17 980 | Repayment Terms: R168 pm x 12*

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In the development of next-generation nanoscale devices, higher speed and lower power operation is the name of the game. Increasing reliance on mobile computers, mobile phone, and other electronic devices demands a greater degree of speed and power. As chemical mechanical planarization (CMP) progressively becomes perceived less as black art and more as a cutting-edge technology, it is emerging as the technology for achieving higher performance devices. Nanoparticle Engineering for Chemical-Mechanical Planarization explains the physicochemical properties of nanoparticles according to each step in the CMP process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP, and noble metal CMP. The authors provide a detailed guide to nanoparticle engineering of novel CMP slurry for next-generation nanoscale devices below the 60nm design rule. They present design techniques using polymeric additives to improve CMP performance. The final chapter focuses on novel CMP slurry for the application to memory devices beyond 50nm technology. Most books published on CMP focus on the polishing process, equipment, and cleaning. Even though some of these books may touch on CMP slurries, the methods they cover are confined to conventional slurries and none cover them with the detail required for the development of next-generation devices. With its coverage of fundamental concepts and novel technologies, this book delivers expert insight into CMP for all current and next-generation systems.

General

Imprint: Crc Press
Country of origin: United Kingdom
Release date: June 2020
First published: 2009
Authors: Ungyu Paik • Jea-Gun Park
Dimensions: 234 x 156mm (L x W)
Format: Paperback
Pages: 224
ISBN-13: 978-0-367-44606-2
Categories: Books > Children's & Educational > Language & literature > English (including English as a school subject) > English language > English language readers > General
Books > Children's Fiction & Fun
LSN: 0-367-44606-5
Barcode: 9780367446062

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