Power Electronic Packaging - Design, Assembly Process, Reliability and Modeling (Hardcover, 2012 ed.)

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	February 2012
First published:	2012
Authors:	Yong Liu
Dimensions:	235 x 155 x 33mm (L x W x T)
Format:	Hardcover
Pages:	594
Edition:	2012 ed.
ISBN-13:	978-1-4614-1052-2
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	1-4614-1052-5
Barcode:	9781461410522

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