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Power Electronic Packaging - Design, Assembly Process, Reliability and Modeling (Hardcover, 2012 ed.)
Loot Price: R7,418
Discovery Miles 74 180
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Power Electronic Packaging - Design, Assembly Process, Reliability and Modeling (Hardcover, 2012 ed.)
Expected to ship within 10 - 15 working days
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Power Electronic Packaging presents an in-depth overview of power
electronic packaging design, assembly,reliability and modeling.
Since there is a drastic difference between IC fabrication and
power electronic packaging, the book systematically introduces
typical power electronic packaging design, assembly, reliability
and failure analysis and material selection so readers can clearly
understand each task's unique characteristics. Power electronic
packaging is one of the fastest growing segments in the power
electronic industry, due to the rapid growth of power integrated
circuit (IC) fabrication, especially for applications like
portable, consumer, home, computing and automotive electronics.
This book also covers how advances in both semiconductor content
and power advanced package design have helped cause advances in
power device capability in recent years. The author extrapolates
the most recent trends in the book's areas of focus to highlight
where further improvement in materials and techniques can drive
continued advancements, particularly in thermal management,
usability, efficiency, reliability and overall cost of power
semiconductor solutions.
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