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1) Focuses on using the agile method in real world examples of
electromechanical product design 2) Follows the process of design,
development and manufacture of electromechanical products 3)
Presents practical guidelines to produce cutting-edge product
designs 4) Explores both engineering drawings and 3D modelling
Successfully Estimate the Thermal and Mechanical Characteristics of
Electronics Systems A definitive guide for practitioners new to the
field or requiring a refresher course, Practical Guide to the
Packaging of Electronics: Thermal and Mechanical Design and
Analysis, Third Edition provides an understanding of system
failures and helps identify the areas where they can occur.
Specifically designed for the mechanical, electrical, or quality
engineer, the book addresses engineering issues involved in
electronics packaging and provides the basics needed to design a
new system or troubleshoot a current one. Updated to reflect recent
developments in the field, this latest edition adds two new
chapters on acoustic and reliability fundamentals, and contains
more information on electrical failures and causes. It also
includes tools for understanding heat transfer, shock, and
vibration. Additionally, the author: Addresses various
cross-discipline issues in the design of electromechanical products
Provides a solid foundation for heat transfer, vibration, and life
expectancy calculations Identifies reliability issues and concerns
Develops the ability to conduct a more thorough analysis for the
final design Includes design tips and guidelines for each aspect of
electronics packaging Practical Guide to the Packaging of
Electronics: Thermal and Mechanical Design and Analysis, Third
Edition explains the mechanical and thermal/fluid aspects of
electronic product design and offers a basic understanding of
electronics packaging design issues. Defining the material
in-depth, it also describes system design guidelines and identifies
reliability concerns for practitioners in mechanical, - electrical
or quality engineering.
Successfully Estimate the Thermal and Mechanical Characteristics of
Electronics Systems A definitive guide for practitioners new to the
field or requiring a refresher course, Practical Guide to the
Packaging of Electronics: Thermal and Mechanical Design and
Analysis, Third Edition provides an understanding of system
failures and helps identify the areas where they can occur.
Specifically designed for the mechanical, electrical, or quality
engineer, the book addresses engineering issues involved in
electronics packaging and provides the basics needed to design a
new system or troubleshoot a current one. Updated to reflect recent
developments in the field, this latest edition adds two new
chapters on acoustic and reliability fundamentals, and contains
more information on electrical failures and causes. It also
includes tools for understanding heat transfer, shock, and
vibration. Additionally, the author: Addresses various
cross-discipline issues in the design of electromechanical products
Provides a solid foundation for heat transfer, vibration, and life
expectancy calculations Identifies reliability issues and concerns
Develops the ability to conduct a more thorough analysis for the
final design Includes design tips and guidelines for each aspect of
electronics packaging Practical Guide to the Packaging of
Electronics: Thermal and Mechanical Design and Analysis, Third
Edition explains the mechanical and thermal/fluid aspects of
electronic product design and offers a basic understanding of
electronics packaging design issues. Defining the material
in-depth, it also describes system design guidelines and identifies
reliability concerns for practitioners in mechanical, - electrical
or quality engineering.
At an early stage of the development, the design teams should ask
questions such as, "How reliable will my product be?" "How reliable
should my product be?" And, "How frequently does the product need
to be repaired / maintained?" To answer these questions, the design
team needs to develop an understanding of how and why their
products fails; then, make only those changes to improve
reliability while remaining within cost budget. The body of
available literature may be separated into three distinct
categories: "theory" of reliability and its associated
calculations; reliability analysis of test or field data - provided
the data is well behaved; and, finally, establishing and managing
organizational reliability activities. The problem remains that
when design engineers face the question of design for reliability,
they are often at a loss. What is missing in the reliability
literature is a set of practical steps without the need to turn to
heavy statistics. Executing Design for Reliability Within the
Product Life Cycle provides a basic approach to conducting
reliability-related streamlined engineering activities, balancing
analysis with a high-level view of reliability within product
design and development. This approach empowers design engineers
with a practical understanding of reliability and its role in the
design process, and helps design team members assigned to
reliability roles and responsibilities to understand how to deploy
and utilize reliability tools. The authors draw on their experience
to show how these tools and processes are integrated within the
design and development cycle to assure reliability, and also to
verify and demonstrate this reliability to colleagues and
customers.
Introduction to Product Design and Development for Engineers
provides guidelines and best practices for the design, development,
and evaluation of engineered products. Created to serve fourth year
undergraduate students in Engineering Design modules with a
required project, the text covers the entire product design process
and product life-cycle, from the initial concept to the design and
development stages, and through to product testing, design
documentation, manufacturability, marketing, and sustainability.
Reflecting the author's long career as a design engineer, this text
will also serve as a practical guide for students working on their
capstone design projects.
Design, development and life-cycle management of any
electromechanical product is a complex task that requires a
cross-functional team spanning multiple organizations, including
design, manufacturing, and service. Ineffective design techniques,
combined with poor communication between various teams, often leads
to delays in product launches, with last minute design compromises
and changes. The purpose of Design of Electromechanical Products: A
Systems Approach is to provide a practical set of guidelines and
best practices for driving world-class design, development, and
sustainability of electromechanical products. The information
provided within this text is applicable across the entire span of
product life-cycle management, from initial concept work to the
detailed design, analysis, and development stages, and through to
product support and end-of-life. It is intended for professional
engineers, designers, and technical managers, and provides a
gateway to developing a product's design history file ("DHF") and
device aster record ("DMR"). These tools enable design engineers to
communicate a product's design, manufacturability, and service
procedures with various cross-functional teams.
Mulla Nasrudin, called Hodja Nasrudin in India and Turkey, is the
major comic figure in Islamic folklore. Both 'mulla' and 'hodja'
mean master, with the connotation teacher; Nasrudin, if he ever
existed, was an educated man. The tales of Nasrudin were never told
by any great Sufi masters, but somehow the common man began to
identify with him. And as various modern writers have pointed out,
the tales contain both spiritual symbolism and the sort of
paradoxical narrative that can break down our habitual view of
reality (rather like the Zen koan) and re-form it on a higher
level. This work is aimed at using a collection of what
superficially can be considered jokes for education and development
of insight, and at the same time bringing two vastly different
Eastern and Western cultures to a better mutual understanding.
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