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This book discusses the practical aspects of electrical and thermal
modeling of packages. In addition, processing concerns for plastic
packaged GaAs parts are also covered. The book emphasizes low cost
industry standard packages. However, the principles involved
translate well to other categories of packages. Digital issues such
as crosstalk are well documented in other books and are therefore
not covered in detail in this text. The principles for generation
of equivalent circuit package models applies to both digital and
analog parts. Digital designers and packaging engineers should
still find this text useful. Subtleties often overlooked by
standard methods of modeling packages for digital applications are
considered and will become more important to the digital packaging
engineer as frequencies continue to increase. It is hoped this book
will be useful to both microwave and digital integrated circuit
(Ie) designers as well as packaging engineers. In the past these
disciplines were distinct. Packaging engineers typically were
concerned with only materials and mechanical issues of the package.
As long as there was an electrical connection made from the die to
the external pin, packaging engineers had the freedom to do
anything they wanted between these two points. At high frequency
the issues change. Packaging engineers now have to work with die
level designers to either create a package that performs well at
high frequencies or to use readily available low cost packages that
happen to meet the needs of the application.
This book discusses the practical aspects of electrical and thermal
modeling of packages. In addition, processing concerns for plastic
packaged GaAs parts are also covered. The book emphasizes low cost
industry standard packages. However, the principles involved
translate well to other categories of packages. Digital issues such
as crosstalk are well documented in other books and are therefore
not covered in detail in this text. The principles for generation
of equivalent circuit package models applies to both digital and
analog parts. Digital designers and packaging engineers should
still find this text useful. Subtleties often overlooked by
standard methods of modeling packages for digital applications are
considered and will become more important to the digital packaging
engineer as frequencies continue to increase. It is hoped this book
will be useful to both microwave and digital integrated circuit
(Ie) designers as well as packaging engineers. In the past these
disciplines were distinct. Packaging engineers typically were
concerned with only materials and mechanical issues of the package.
As long as there was an electrical connection made from the die to
the external pin, packaging engineers had the freedom to do
anything they wanted between these two points. At high frequency
the issues change. Packaging engineers now have to work with die
level designers to either create a package that performs well at
high frequencies or to use readily available low cost packages that
happen to meet the needs of the application.
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