0
Your cart

Your cart is empty

Books > Professional & Technical > Energy technology & engineering > Electrical engineering

Buy Now

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Paperback, Softcover reprint of the original 1st ed. 1999) Loot Price: R2,776
Discovery Miles 27 760
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Paperback, Softcover reprint of...

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications (Paperback, Softcover reprint of the original 1st ed. 1999)

Dean L. Monthei

Series: Electronic Packaging and Interconnects, 2

 (sign in to rate)
Loot Price R2,776 Discovery Miles 27 760 | Repayment Terms: R260 pm x 12*

Bookmark and Share

Expected to ship within 10 - 15 working days

This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Electronic Packaging and Interconnects, 2
Release date: August 2014
First published: 1999
Authors: Dean L. Monthei
Dimensions: 235 x 155 x 13mm (L x W x T)
Format: Paperback
Pages: 234
Edition: Softcover reprint of the original 1st ed. 1999
ISBN-13: 978-1-4613-7325-4
Categories: Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Automatic control engineering > General
LSN: 1-4613-7325-5
Barcode: 9781461373254

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!

Partners