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System-level Modeling of MEMS (Hardcover, Volume 10): Tamara Bechtold, Gabriele Schrag, Lihong Feng System-level Modeling of MEMS (Hardcover, Volume 10)
Tamara Bechtold, Gabriele Schrag, Lihong Feng; Edited by Oliver Brand, Gary K. Fedder, …
R4,551 R3,818 Discovery Miles 38 180 Save R733 (16%) Out of stock

System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.

Simulation of Semiconductor Processes and Devices 2004 (Paperback, Softcover reprint of the original 1st ed. 2004): Gerhard... Simulation of Semiconductor Processes and Devices 2004 (Paperback, Softcover reprint of the original 1st ed. 2004)
Gerhard Wachutka, Gabriele Schrag
R5,456 Discovery Miles 54 560 Ships in 10 - 15 working days

This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.

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