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Simulation of Semiconductor Processes and Devices 2004 (Paperback, Softcover reprint of the original 1st ed. 2004)
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Simulation of Semiconductor Processes and Devices 2004 (Paperback, Softcover reprint of the original 1st ed. 2004)
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This volume contains the proceedings of the 10th edition of the
International Conference on Simulation of Semiconductor Processes
and Devices (SISPAD 2004), held in Munich, Germany, on September
2-4, 2004. The conference program included 7 invited plenary
lectures and 82 contributed papers for oral or poster presentation,
which were carefully selected out of a total of 151 abstracts
submitted from 14 countries around the world. Like the previous
meetings, SISPAD 2004 provided a world-wide forum for the
presentation and discussion of recent advances and developments in
the theoretical description, physical modeling and numerical
simulation and analysis of semiconductor fabrication processes,
device operation and system performance. The variety of topics
covered by the conference contributions reflects the physical
effects and technological problems encountered in consequence of
the progressively shrinking device dimensions and the ever-growing
complexity in device technology.
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