|
Showing 1 - 5 of
5 matches in All Departments
|
Microengineering of Metals and Ceramics, Part I - Design, Tooling, and Injection Molding (Hardcover)
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, …
|
R5,961
R5,114
Discovery Miles 51 140
Save R847 (14%)
|
Out of stock
|
Microstructures, electronics, nanotechnology - these vast fields of
research are growing together as the size gap narrows and many
different materials are combined. Current research, engineering
sucesses and newly commercialized products hint at the immense
innovative potentials and future applications that open up once
mankind controls shape and function from the atomic level right up
to the visible world without any gaps.
In this volume, authors from three major competence centres for
microengineering illustrate step by step the process from designing
and simulating microcomponents of metallic and ceramic materials to
replicating micro-scale components by injection molding.
Microstructures, electronics, nanotechnology - these vast fields of
research are growing together as the size gap narrows and many
different materials are combined. Current research, engineering
sucesses and newly commercialized products hint at the immense
innovative potentials and future applications that open up once
mankind controls shape and function from the atomic level right up
to the visible world without any gaps.
Continuing from the previous volume, authors from three major
competence centres for microengineering here cover all aspects of
specialized replication techniques and how to employ
state-of-the-art technologies for testing and characterizing
micro-scale components, and illustrate quality control aspects and
strategies for automation of production procedures in view of
future industrial production and commercialisation.
This edition of 'CMOS-MEMS' was originally published in the
successful series 'Advanced Micro & Nanosystems'. A close look
at enabling technologies is taken, the first section on MEMS
featuring an introduction to the challenges and benefi ts of
three-dimensional silicon processing. An insider's view of
industrial MEMS commercialization is followed by chapters on
capacitive interfaces for MEMS, packaging issues of micro- and
nanosystems, MEMS contributions to high frequency integrated
resonators and filters, and the uses of MEMS in mass data storage
and electrochemical imaging by means of scanning micro- and
nanoprobes. The second section on nanodevices first tackles the
emerging topic of nanofluidics with a contribution each on
simulation tools and on devices and uses, followed by another two
on nanosensors featuring CNT sensors and CMOS-based DNA sensor
arrays, respectively.
Computer-aided-design (CAD) of semiconductor microtransducers is
relatively new in contrast to their counterparts in the integrated
circuit world. Integrated silicon microtransducers are realized
using microfabrication techniques similar to those for standard
integrated circuits (ICs). Unlike IC devices, however,
microtransducers must interact with their environment, so their
numerical simulation is considerably more complex. While the design
of ICs aims at suppressing "parasitic effects, microtransducers
thrive on optimizing the one or the other such effect. The
challenging quest for physical models and simulation tools enabling
microtransducer CAD is the topic of this book. It is intended as a
text for graduate students in Electrical Engineering and Physics
and as a reference for CAD engineers in the microsystems industry.
This text evolved from a series of courses offered to graduate
students from Electrical Engineering and Physics. Much of the
material in the book can be presented in about 40 hours of lecture
time. The book starts with an illustrative example which highlights
the goals and benefits of microtransducer CAD. This follows with a
summary of model equations describing electrical transport in
semiconductor devices and microtransducers in the absence of
external fields. Models treating the effects of the external
radiant, magnetic, thermal, and mechanical fields on electrical
transport are then systematically introduced. To enable a smooth
transition into modeling of mechanical systems, an abridged version
of solid structural and fluid mechanics is presented, whereby the
focus is on pertinent model equations and boundary conditions. This
follows with model equations and boundary conditions relevant to
various types of mechanical microactuators including electrostatic,
thermal, magnetic, piezoelectric, and electroacoustic. The book
concludes with a glimpse into SPICE simulation of the mixed-signal
microsystem, i.e., microtransducer plus circuitry. Where possible,
the model equations are supplemented with tables and/or graphs of
process-dependent material data to enable the CAD engineer to carry
out simulations even when reliable material models are not
available. IVZ LANG: Introduction: Modeling and Simulation of
Microtransducers; Illustrative Example; Progress in Microtransducer
Modeling; References.- Basic Electronic Transport: Poisson s
Equation; Continuity Equations; Carrier Transport in Crystalline
Materials and Isothermal Behavior; Electrical Conductivity and
Isothermal Behavior in Polycrystalline Materials; Electrical
Conductivity and Isothermal Behavior in Metals; Boundary and
Interface Conditions; The External Fields What Do They Influence?;
References.- Radiation Effects on Carrier Transport: Reflection and
Transmission of Optical Signals; Modeling Optical Absorption in
Intrinsic Semiconductors; Absorption in Heavily-Doped
Semiconductors; Optical Generation Rate and Quantum Efficiency; Low
Energy Interactions with Insulators and Metals; High Energy
Interactions and Monte Carlo Simulations; Model Equations for
Radiant Sensor Simulation; Illustrative Simulation Example Color
Sensor; References.- Magnetic-Field Effects on Carrier Transport:
Galvanomagnetic Transport Equation; Galvanomagnetic Transport
Coefficients; Equations and Boundary Conditions for Magnetic Sensor
Simulation; Illustrative Simulation Example Micromachined Magnetic
Vector Probe; References.- Thermal Non-Uniformity Effects on
Carrier Transport: Non-Isothermal Effects; Electrothermal Transport
Model; Electrical and Thermal Transport Coefficients;
Electro-Thermo-Magnetic Interactions; Heat Transfer in Thermal
Microstructures; Summary of Equations and Computational Procedure;
Illustrative Simulation Example Micro Pirani Gauge; References.-
Mechanical Effects on Carrier Transport: Piezoresistive Effect;
Strain and Electron Transport; Strain and Hole Transport;
Piezojunction Effect; Effects of Stress Gradients;
Galvano-Piezo-Magnetic Effects; The Piezo Drift-Diffusion Transport
Model; Illustrative Simulation Example Stress Effects on Hall
Sensors; References.- Mechanical and Fluidic Signals: Definitions;
Model Equations for Mechanical Analysis; Model Equations for
Analysis of Fluid Transport; Illustrative Simulation Example
Analysis of Flow Channels; References.- Micro-Actuation:
Transduction Principles; State-of-the-Art and Preview;
Electrostatic Actuation; Thermal Actuation; Magnetic Actuation;
Piezoelectric Actuation; Electroacoustic Transducers; Computational
Procedure and Coupling; Illustrative Example CMOS Micromirror.-
Microsystem Simulation: Electrical Analogues for Mixed-Signals and
Historical Developments; Circuit Modeling and Implementation
Considerations; Lumped Analysis: Illustrative Example Electrostatic
Micromirror; Distributed Analysis: Illustrative Example Flow
Microsensor; References.- Subject Index."
|
Cmos - Mems (Hardcover, Volume 2)
Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, …
|
R8,296
R7,110
Discovery Miles 71 100
Save R1,186 (14%)
|
Out of stock
|
Microstructures, electronics, nanotechnology - these vast fields of
research are growing together as the size gap narrows and many
different materials are combined. Current research, engineering
sucesses and newly commercialized products hint at the immense
innovative potentials and future applications that open up once
mankind controls shape and function from the atomic level right up
to the visible world without any gaps.
Sensor systems, microreactors, nanostructures, nanomachines,
functional surfaces, integrated optics, displays, communications
technology, biochips, human/machine interfaces, prosthetics,
miniaturized medical and surgery equipment and many more
opportunities are being explored.
This new series, Advanced Micro and Nano Systems, provides
cutting-edge reviews from top authors on technologies, devices and
advanced systems from the micro and nano worlds.
|
You may like...
Loot
Nadine Gordimer
Paperback
(2)
R398
R330
Discovery Miles 3 300
|