The exploitation of MicroElectroMechanical-Systems for Radio Frequency applications (RF-MEMS) has been attracting the interest of the Scientific Community through the past decade, because of its potentialities in terms of high-performance and large reconfigurability it can enable in transceiver platform (e.g. in satellites, radars, mobile phones). This work addresses two critical issues leading to the successful exploitation of RF-MEMS technology, namely the modeling of their multi-physical behaviour (electromechanical and electromagnetic) and the packaging/encapsulation of such devices to enable their operability and integration with standard technologies. The first issue is addressed with the development of MEMS behavioural compact models, allowing fast and accurate simulations within commercial IC development frameworks. The packaging issue is treated by discussing several technology solutions and focusing on the Wafer-Level-Packaging approach. This book provides the reader with useful and practical information on the modeling, simulation and integration of RF-MEMS, and it is particularly suitable for Scientists, Researchers, Designers and Technologists in the RF-MEMS field.

Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books.

The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages.Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device conceptsCovers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applicationsAddresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionalityBridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results

Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.