Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: * Tamper-proof adhesives for electronic security devices. * Bio-compatible adhesives for implantable medical devices. * Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). * Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Since publication of the first edition in 1988 many significant advances have occurred in IC chips that have driven the hybrid packaging processes toward even higher densities and greater performance. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamentals of design, fabrication, and testing of MCMs are essentially the same as for hybrid microcircuit. In the authors' opinion MCMs are extensions of hybrid circuits that can accommodate the new generation of high-speed high-performance chips.

In this revised edition they have therefore expanded their treatment of hybrid circuits without finding it necessary to change the fundamentals. They have included a separate chapter on multichip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: metal-matrix composites and aluminum nitride as substrate materials, plastic encapsulated microcircuits and chip-on-board as low-cost alternatives to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BGA) packages. Since the first edition, there have also been tremendous advances in software programs for thermal and electrical analysis and these are also treated in this new edition.

The abbreviated Table ofContents below includes the chapter titles and selected sub-headings.