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This book provides a single-source reference on the use of carbon
nanotubes (CNTs) as interconnect material for horizontal, on-chip
and 3D interconnects. The authors demonstrate the uses of bundles
of CNTs, as innovative conducting material to fabricate
interconnect through-silicon vias (TSVs), in order to improve the
performance, reliability and integration of 3D integrated circuits
(ICs). This book will be first to provide a coherent overview of
exploiting carbon nanotubes for 3D interconnects covering aspects
from processing, modeling, simulation, characterization and
applications. Coverage also includes a thorough presentation of the
application of CNTs as horizontal on-chip interconnects which can
potentially revolutionize the nanoelectronics industry. This book
is a must-read for anyone interested in the state-of-the-art on
exploiting carbon nanotubes for interconnects for both 2D and 3D
integrated circuits.
This book provides a single-source reference on the use of carbon
nanotubes (CNTs) as interconnect material for horizontal, on-chip
and 3D interconnects. The authors demonstrate the uses of bundles
of CNTs, as innovative conducting material to fabricate
interconnect through-silicon vias (TSVs), in order to improve the
performance, reliability and integration of 3D integrated circuits
(ICs). This book will be first to provide a coherent overview of
exploiting carbon nanotubes for 3D interconnects covering aspects
from processing, modeling, simulation, characterization and
applications. Coverage also includes a thorough presentation of the
application of CNTs as horizontal on-chip interconnects which can
potentially revolutionize the nanoelectronics industry. This book
is a must-read for anyone interested in the state-of-the-art on
exploiting carbon nanotubes for interconnects for both 2D and 3D
integrated circuits.
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