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The emerging three-dimensional (3D) chip architectures, with their
intrinsic capability of reducing the wire length, promise
attractive solutions to reduce the delay of interconnects in future
microprocessors. 3D memory stacking enables much higher memory
bandwidth for future chip-multiprocessor design, mitigating the
"memory wall" problem. In addition, heterogenous integration
enabled by 3D technology can also result in innovative designs for
future microprocessors. This book first provides a brief
introduction to this emerging technology, and then presents a
variety of approaches to designing future 3D microprocessor
systems, by leveraging the benefits of low latency, high bandwidth,
and heterogeneous integration capability which are offered by 3D
technology.
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