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Solder joints are ubiquitous in electronic consumer products.
The European Union has a directive to ban the use of Pb-based
solders in these products on July 1st, 2006. There is an urgent
need for an increase in the research and development of Pb-free
solders in electronic manufacturing. For example, spontaneous Sn
whisker growth and electromigration induced failure in solder
joints are serious issues. These reliability issues are quite
complicated due to the combined effect of electrical, mechanical,
chemical, and thermal forces on solder joints. To improve solder
joint reliability, the science of solder joint behavior under
various driving forces must be understood. In this book, the
advanced materials reliability issues related to copper-tin
reaction and electromigration in solder joints are emphasized and
methods to prevent these reliability problems are discussed.
Solder joints are ubiquitous in electronic consumer products. The
European Union has a directive to ban the use of Pb-based solders
in these products on July 1st, 2006. There is an urgent need for an
increase in the research and development of Pb-free solders in
electronic manufacturing. For example, spontaneous Sn whisker
growth and electromigration induced failure in solder joints are
serious issues. These reliability issues are quite complicated due
to the combined effect of electrical, mechanical, chemical, and
thermal forces on solder joints. To improve solder joint
reliability, the science of solder joint behavior under various
driving forces must be understood. In this book, the advanced
materials reliability issues related to copper-tin reaction and
electromigration in solder joints are emphasized and methods to
prevent these reliablity problems are discussed.
Thin films are widely used in the electronic device industry. As
the trend for miniaturization of electronic devices moves into the
nanoscale domain, the reliability of thin films becomes an
increasing concern. Building on the author's previous book,
Electronic Thin Film Science by Tu, Mayer and Feldman, and based on
a graduate course at UCLA given by the author, this new book
focuses on reliability science and the processing of thin films.
Early chapters address fundamental topics in thin film processes
and reliability, including deposition, surface energy and atomic
diffusion, before moving onto systematically explain irreversible
processes in interconnect and packaging technologies. Describing
electromigration, thermomigration and stress migration, with a
closing chapter dedicated to failure analysis, the reader will come
away with a complete theoretical and practical understanding of
electronic thin film reliability. Kept mathematically simple, with
real-world examples, this book is ideal for graduate students,
researchers and practitioners.
Nanoscale materials are showing great promise in various
electronic, optoelectronic, and energy applications. Silicon (Si)
has especially captured great attention as the leading material for
microelectronic and nanoscale device applications. Recently,
various silicides have garnered special attention for their pivotal
role in Si device engineering and for the vast potential they
possess in fields such as thermoelectricity and magnetism. The
fundamental understanding of Si and silicide material processes at
nanoscale plays a key role in achieving device structures and
performance that meet real-world requirements and, therefore,
demands investigation and exploration of nanoscale device
applications. This book comprises the theoretical and experimental
analysis of various properties of silicon nanocrystals, research
methods and techniques to prepare them, and some of their promising
applications.
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