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Microelectronic Packaging (Hardcover)
Darrel Richard Frear; Edited by M. Datta; Contributions by Paul A. Kohl; Edited by Tetsuya Osaka, J. Walter Schultze; Contributions by …
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R7,908
Discovery Miles 79 080
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Ships in 10 - 15 working days
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Microelectronic Packaging analyzes the massive impact of
electrochemical technologies on various levels of microelectronic
packaging. Traditionally, interconnections within a chip were
considered outside the realm of packaging technologies, but this
book emphasizes the importance of chip wiring as a key aspect of
microelectronic packaging, and focuses on electrochemical
processing as an enabler of advanced chip metallization. Divided
into five parts, the book begins by outlining the basics of
electrochemical processing, defining the microelectronic packaging
hierarchy, and emphasizing the impact of electrochemical technology
on packaging. The second part discusses chip metallization topics
including the development of robust barrier layers and alternative
metallization materials. Part III explores key aspects of
chip-package interconnect technologies, followed by Part IV's
analysis of packages, boards, and connectors which covers materials
development, technology trends in ceramic packages and multi-chip
modules, and electroplated contact materials. Illustrating the
importance of processing tools in enabling technology development,
the book concludes with chapters on chemical mechanical
planarization, electroplating, and wet etching/cleaning tools.
Experts from industry, universities, and national laboratories
submitted reviews on each of these subjects, capturing the
technological advances made in each area. A detailed examination of
how packaging responds to the challenges of Moore's law, this book
serves as a timely and valuable reference for microelectronic
packaging and processing professionals and other industrial
technologists.
This book focuses on the nature and properties of soils of Hindu
Kush-Himalayas and their management for agricultural land use. It
discusses all aspects of climatic variations and potential of
resources in the Himalayan region including examples from
Afghanistan, Bangladesh, Bhutan, China (Tibet), India, Myanmar,
Nepal and Pakistan. Chapters cover the geology of the parent
material of native soils, soils microbes, flora and fauna. Soil
classification has been given in detail to better understand the
nature of soils for judicious management strategies. The authors
present land use practices and suggestions for changes in land use
to benefit from the full potential of the soils in this region.
Their ultimate aim is to find ways of feeding the ever-increasing
population and raising the standard of life for the people living
in the Himalayan mountain region.
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