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Microelectronic Packaging (Hardcover): Darrel Richard Frear Microelectronic Packaging (Hardcover)
Darrel Richard Frear; Edited by M. Datta; Contributions by Paul A. Kohl; Edited by Tetsuya Osaka, J. Walter Schultze; Contributions by …
R7,485 Discovery Miles 74 850 Ships in 10 - 15 working days

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Soils in the Hindu Kush Himalayas - Management for Agricultural Land Use (Hardcover, 1st ed. 2022): U C Sharma, M. Datta, Vikas... Soils in the Hindu Kush Himalayas - Management for Agricultural Land Use (Hardcover, 1st ed. 2022)
U C Sharma, M. Datta, Vikas Sharma
R4,334 Discovery Miles 43 340 Ships in 10 - 15 working days

This book focuses on the nature and properties of soils of Hindu Kush-Himalayas and their management for agricultural land use. It discusses all aspects of climatic variations and potential of resources in the Himalayan region including examples from Afghanistan, Bangladesh, Bhutan, China (Tibet), India, Myanmar, Nepal and Pakistan. Chapters cover the geology of the parent material of native soils, soils microbes, flora and fauna. Soil classification has been given in detail to better understand the nature of soils for judicious management strategies. The authors present land use practices and suggestions for changes in land use to benefit from the full potential of the soils in this region. Their ultimate aim is to find ways of feeding the ever-increasing population and raising the standard of life for the people living in the Himalayan mountain region.

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