Microelectronic Packaging (Hardcover)

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

General

Imprint:	Crc Press
Country of origin:	United Kingdom
Series:	New Trends in Electrochemical Technology
Release date:	December 2004
First published:	December 2004
Contributors:	Darrel Richard Frear
Editors:	M. Datta
Contributors:	Paul A. Kohl
Editors:	Tetsuya Osaka • J. Walter Schultze
Contributors:	Sol Krongelb • Yutaka Okinaka • David Kwesi Watts • Haruo Akahoshi • Jeffery W. Butterbaugh
Dimensions:	234 x 156 x 30mm (L x W x T)
Format:	Hardcover
Pages:	568
ISBN-13:	978-0-415-31190-8
Categories:	Books > Science & Mathematics > Chemistry > Physical chemistry > Electrochemistry & magnetochemistry Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	0-415-31190-X
Barcode:	9780415311908

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