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This book starts with background concerning three-dimensional
integration - including their low energy consumption and high speed
image processing - and then proceeds to how to construct them and
which materials to use in particular situations. The book covers
numerous applications, including next generation smart phones,
driving assistance systems, capsule endoscopes, homing missiles,
and many others. The book concludes with recent progress and
developments in three dimensional packaging, as well as future
prospects.
This book starts with background concerning three-dimensional
integration - including their low energy consumption and high speed
image processing - and then proceeds to how to construct them and
which materials to use in particular situations. The book covers
numerous applications, including next generation smart phones,
driving assistance systems, capsule endoscopes, homing missiles,
and many others. The book concludes with recent progress and
developments in three dimensional packaging, as well as future
prospects.
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