0
Your cart

Your cart is empty

Browse All Departments
  • All Departments
Price
  • R1,000 - R2,500 (1)
  • R5,000 - R10,000 (1)
  • -
Status
Brand

Showing 1 - 2 of 2 matches in All Departments

Semiconductor Packaging - Materials Interaction and Reliability (Paperback): Andrea Chen, Randy Hsiao-Yu Lo Semiconductor Packaging - Materials Interaction and Reliability (Paperback)
Andrea Chen, Randy Hsiao-Yu Lo
R2,112 Discovery Miles 21 120 Ships in 12 - 17 working days

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Semiconductor Packaging - Materials Interaction and Reliability (Hardcover): Andrea Chen, Randy Hsiao-Yu Lo Semiconductor Packaging - Materials Interaction and Reliability (Hardcover)
Andrea Chen, Randy Hsiao-Yu Lo
R5,566 Discovery Miles 55 660 Ships in 12 - 17 working days

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Free Delivery
Pinterest Twitter Facebook Google+
You may like...
Tenet
John David Washington, Robert Pattinson Blu-ray disc  (1)
R51 Discovery Miles 510
Dig & Discover: Ancient Egypt - Excavate…
Hinkler Pty Ltd Kit R256 R222 Discovery Miles 2 220
Home Classix Silicone Flower Design Mat…
R49 R37 Discovery Miles 370
Moon Bag (Black)
R57 Discovery Miles 570
We Were Perfect Parents Until We Had…
Vanessa Raphaely, Karin Schimke Paperback R330 R220 Discovery Miles 2 200
Multi-Functional Bamboo Standing Laptop…
R1,399 R669 Discovery Miles 6 690
Playground Colourtime Backpacks
R199 Discovery Miles 1 990
Cadac Pizza Stone (33cm)
 (18)
R398 Discovery Miles 3 980
Discovering Daniel - Finding Our Hope In…
Amir Tsarfati, Rick Yohn Paperback R280 R210 Discovery Miles 2 100
Bostik Clear Gel (25ml)
R40 R23 Discovery Miles 230

 

Partners