0
Your cart

Your cart is empty

Browse All Departments
  • All Departments
Price
  • R1,000 - R2,500 (1)
  • R5,000 - R10,000 (1)
  • -
Status
Brand

Showing 1 - 2 of 2 matches in All Departments

Semiconductor Packaging - Materials Interaction and Reliability (Paperback): Andrea Chen, Randy Hsiao-Yu Lo Semiconductor Packaging - Materials Interaction and Reliability (Paperback)
Andrea Chen, Randy Hsiao-Yu Lo
R2,400 Discovery Miles 24 000 Ships in 10 - 15 working days

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing-package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Semiconductor Packaging - Materials Interaction and Reliability (Hardcover): Andrea Chen, Randy Hsiao-Yu Lo Semiconductor Packaging - Materials Interaction and Reliability (Hardcover)
Andrea Chen, Randy Hsiao-Yu Lo
R6,295 Discovery Miles 62 950 Ships in 18 - 22 working days

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Free Delivery
Pinterest Twitter Facebook Google+
You may like...
Home Classix Double Wall Tumbler (360ml…
R89 R79 Discovery Miles 790
Adidas Combat Sport Backpack (Navy Blue)
R686 R572 Discovery Miles 5 720
Crucial P310 | 1TB | M.2 NVMe | 3D NAND…
R2,739 R2,527 Discovery Miles 25 270
Loot
Nadine Gordimer Paperback  (2)
R367 R340 Discovery Miles 3 400
ZA Cute Butterfly Earrings and Necklace…
R712 R499 Discovery Miles 4 990
Loot
Nadine Gordimer Paperback  (2)
R367 R340 Discovery Miles 3 400
Telefunken TWR-300U World Band Radio…
 (3)
R499 R472 Discovery Miles 4 720
Law@Work
A. Van Niekerk, N. Smit Paperback R1,367 R1,229 Discovery Miles 12 290
Liz Claiborne Curve Cologne Spray for…
R1,259 R926 Discovery Miles 9 260
Higher
Michael Buble CD  (1)
R342 Discovery Miles 3 420

 

Partners