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The development of electronics that can operate at high
temperatures has been identified as a critical technology for the
next century. Increasingly, engineers will be called upon to design
avionics, automotive, and geophysical electronic systems requiring
components and packaging reliable to 200 DegreesC and beyond. Until
now, however, they have had no single resource on high temperature
electronics to assist them. Such a resource is critically needed,
since the design and manufacture of electronic components have now
made it possible to design electronic systems that will operate
reliably above the traditional temperature limit of 125 DegreesC.
However, successful system development efforts hinge on a firm
understanding of the fundamentals of semiconductor physics and
device processing, materials selection, package design, and thermal
management, together with a knowledge of the intended application
environments. High Temperature Electronics brings together this
essential information and presents it for the first time in a
unified way. Packaging and device engineers and technologists will
find this book required reading for its coverage of the techniques
and tradeoffs involved in materials selection, design, and thermal
management and for its presentation of best design practices using
actual fielded systems as examples. In addition, professors and
students will find this book suitable for graduate-level courses
because of its detailed level of explanation and its coverage of
fundamental scientific concepts. Experts from the field of high
temperature electronics have contributed to nine chapters covering
topics ranging from semiconductor device selection to testing and
final assembly.
The development of electronics that can operate at high
temperatures has been identified as a critical technology for the
next century. Increasingly, engineers will be called upon to design
avionics, automotive, and geophysical electronic systems requiring
components and packaging reliable to 200 ?C and beyond. Until now,
however, they have had no single resource on high temperature
electronics to assist them.
Such a resource is critically needed, since the design and
manufacture of electronic components have now made it possible to
design electronic systems that will operate reliably above the
traditional temperature limit of 125 ?C. However, successful system
development efforts hinge on a firm understanding of the
fundamentals of semiconductor physics and device processing,
materials selection, package design, and thermal management,
together with a knowledge of the intended application
environments.
High Temperature Electronics brings together this essential
information and presents it for the first time in a unified way.
Packaging and device engineers and technologists will find this
book required reading for its coverage of the techniques and
tradeoffs involved in materials selection, design, and thermal
management and for its presentation of best design practices using
actual fielded systems as examples. In addition, professors and
students will find this book suitable for graduate-level courses
because of its detailed level of explanation and its coverage of
fundamental scientific concepts.
Experts from the field of high temperature electronics have
contributed to nine chapters covering topics ranging from
semiconductor device selection to testing and final assembly.
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