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The desire for having a smaller-faster chip that does more than
ever before, has led to shrinking feature size and growing
integration density. This integration has left designers grappling
with increasing concerns of signal-integrity (SI), timing- closure
and power-consumption. Firstly, the shrinking feature size has
resulted in greater delays. Further, the adjacent wires are now
very close and cause Cross-talk to each other's signals.
Traditional designs focus on protecting SI on long parallel wires.
The SI designs accomodate the worst case delays of signals; while
they aim to improve the worst-case delays at a circuit level using
novel tricks, they are transparent to the actual data carried in
the wires. Departing from this trend, this work aims to introduce
an information theoretic approach to address data-integrity (DI). A
novel approach for evaluating the data carrying capacity of long
parallel wires is presented herein. This capacity is much greater
than the data-rate achieved by SI designs. This work also proposes
several practical designs with data-rate approaching this capacity.
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Unique Chips and Systems (Hardcover)
Eugene John, Juan Rubio; Series edited by Vojin G. Oklobdzija; Contributions by Tao Li, Chand John, …
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R4,001
Discovery Miles 40 010
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Ships in 12 - 17 working days
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Which came first, the system or the chip? While integrated circuits
enable technology for the modern information age, computing,
communication, and network chips fuel it. As soon as the
integration ability of modern semiconductor technology offers
presents opportunities, issues in power consumption, reliability,
and form-factor present challenges. The demands of emerging
software applications can only be met with unique systems and
chips. Drawing on contributors from academia, research, and
industry, Unique Systems and Chips explores unique approaches to
designing future computing and communication chips and systems. The
book focuses on specialized hardware and systems as opposed to
general-purpose chips and systems. It covers early conception and
simulation, mid-development, application, testing, and performance.
The chapter authors introduce new ideas and innovations in unique
aspects of chips and system design, then go on to provide in-depth
analysis of these ideas. They explore ways in which these chips and
systems may be used in further designs or products, spurring
innovations beyond the intended scopes of those presented.
International in flavor, the book brings industrial and academic
perspectives into focus by presenting the full spectrum of
applications of chips and systems.
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