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This book presents device design, layout design, FEM analysis,
device fabrication, and packaging and testing of MEMS-based
piezoelectric vibration energy harvesters. It serves as a complete
guide from design, FEM, and fabrication to characterization. Each
chapter of this volume illustrates key insight technologies through
images. The book showcases different technologies for energy
harvesting and the importance of energy harvesting in wireless
sensor networks. The design, simulation, and comparison of three
types of structures - single beam cantilever structure, cantilever
array structure, and guided beam structure have also been reported
in one of the chapters. In this volume, an elaborate
characterization of two-beam and four-beam fabricated devices has
been carried out. This characterization includes structural,
material, morphological, topological, dynamic, and electrical
characterization of the device. The volume is very concise, easy to
understand, and contains colored images to understand the details
of each process.
This book presents device design, layout design, FEM analysis,
device fabrication, and packaging and testing of MEMS-based
piezoelectric vibration energy harvesters. It serves as a complete
guide from design, FEM, and fabrication to characterization. Each
chapter of this volume illustrates key insight technologies through
images. The book showcases different technologies for energy
harvesting and the importance of energy harvesting in wireless
sensor networks. The design, simulation, and comparison of three
types of structures - single beam cantilever structure, cantilever
array structure, and guided beam structure have also been reported
in one of the chapters. In this volume, an elaborate
characterization of two-beam and four-beam fabricated devices has
been carried out. This characterization includes structural,
material, morphological, topological, dynamic, and electrical
characterization of the device. The volume is very concise, easy to
understand, and contains colored images to understand the details
of each process.
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