Integrating latest research results and characterization techniques, this book helps readers understand and apply fundamental principles in nonlinear polymer rheology. The author connects the basic theoretical framework with practical polymer processing, which aids practicing scientists and engineers to go beyond the existing knowledge and explore new applications. Describes the emerging phenomena and associated conceptual understanding in the field of nonlinear polymer rheology Incorporates details on latest experimental discoveries and provides new methodology for research in polymer rheology Integrates latest research results and new characterization techniques like particle tracking velocimetric method Focuses on the issues concerning the conceptual and phenomenological foundations for polymer rheology

Interest in developing low-dielectric constant materials is driven by requirements from the microelectronics sector to improve performance in interconnections by reducing parasitic capacitance and cross talk. The continuing increase in density of semiconductor devices is becoming limited by the dielectric properties of the insulator which threatens to slow the rate of productivity. The requirement for dielectric constant is rapidly approaching an e value of 2.0, with continued improvement sought even below this level to maintain this progression, commonly known as Moore's Law. Synthetic methods of obtaining materials in this range are addressed in this book. The materials solution to the interconnect problem - changing the insulator to lower the dielectric constant from 4.0, the e of silicon dioxide - introduces a host of reliability concerns, as well as changes to the process of manufacturing semiconductor devices. Topics include: porous films - organic and inorganic; porous films - organic/low-k integration; low-k integration; low-k/advanced interconnect; low-dielectric constant materials and applications in microelectronics and low-k film property/integration.