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Reviewing the various IC packaging, assembly, and
interconnection technologies, this professional reference provides
an overview of the materials and the processes, as well as the
trends and available options that encompass electronic
manufacturing. It covers both the technical issues and touches on
some of the reliability concerns with the various technologies
applicable to packaging and assembly of the IC. The book discusses
the various packaging approaches, assembly options, and essential
manufacturing technologies, among other relevant topics.
Reviewing the various IC packaging, assembly, and
interconnection technologies, this professional reference provides
an overview of the materials and the processes, as well as the
trends and available options that encompass electronic
manufacturing. It covers both the technical issues and touches on
some of the reliability concerns with the various technologies
applicable to packaging and assembly of the IC. The book discusses
the various packaging approaches, assembly options, and essential
manufacturing technologies, among other relevant topics.
Containing The Text Of The Act With Explanatory Notes, Comparative
Tables Of Repealed Statutes, Minutes Of The Board Of Agriculture,
Scales Of Compensation, Numerous Forms, And A Full Analytical
Index.
Containing The Text Of The Act With Explanatory Notes, Comparative
Tables Of Repealed Statutes, Minutes Of The Board Of Agriculture,
Scales Of Compensation, Numerous Forms, And A Full Analytical
Index.
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