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Modeling and Application of Flexible Electronics Packaging (Hardcover, 1st ed. 2019): Yongan Huang, Zhouping Yin, Xiaodong Wan Modeling and Application of Flexible Electronics Packaging (Hardcover, 1st ed. 2019)
Yongan Huang, Zhouping Yin, Xiaodong Wan
R2,823 Discovery Miles 28 230 Ships in 10 - 15 working days

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

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