To meet the demands of students, scientists and engineers for a systematic reference source, this book introduces, comprehensively and in a single voice, research and development progress in emerging metamaterials and derived functional metadevices. Coverage includes electromagnetic, optical, acoustic, thermal, and mechanical metamaterials and related metadevices. Metamaterials are artificially engineered composites with designed properties beyond those attainable in nature and with applications in all aspects of materials science. From spatially tailored dielectrics to tunable, dynamic materials properties and unique nonlinear behavior, metamaterial systems have demonstrated tremendous flexibility and functionality in electromagnetic, optical, acoustic, thermal, and mechanical engineering. Furthermore, the field of metamaterials has been extended from the mere pursuit of various exotic properties towards the realization of practical devices, leading to the concepts of dynamically-reconfigurable metadevices and functional metasurfaces. The book explores the fundamental physics, design, and engineering aspects, as well as the full array of state-of-the-art applications to electronics, telecommunications, antennas, and energy harvesting. Future challenges and potential in regard to design, modeling and fabrication are also addressed.

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find "Advanced Materials for Integrated Optical Waveguides" to be an invaluable reference for meeting these research and development goals.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

With electromagnetic compliance (EMC) now a major factor in the design of all electronic products, it is crucial to understand how electromagnetic interference (EMI) shielding products are used in various industries. Focusing on the practicalities of this area, Advanced Materials and Design for Electromagnetic Interference Shielding comprehensively introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding.

After an overview of EMI shielding theory and product design guidelines, the book extensively reviews the characterization methodology of EMI materials. Subsequent chapters focus on particular EMI shielding materials and component designs, including enclosures, metal-formed gaskets, conductive elastomer and flexible graphite components, conductive foam and ventilation structures, board-level shielding materials, composite materials and hybrid structures, absorber materials, grounding and cable-level shielding materials, and aerospace and nuclear shielding materials. The last chapter presents a perspective on future trends in EMI shielding materials and design.

Offering detailed coverage on many important topics, this indispensable book illustrates the efficiency and reliability of a range of materials and design solutions for EMI shielding.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.