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Reliability, Robustness and Failure Mechanisms of LED Devices - Methodology and Evaluation (Hardcover): Yannick Deshayes,... Reliability, Robustness and Failure Mechanisms of LED Devices - Methodology and Evaluation (Hardcover)
Yannick Deshayes, Laurent Bechou
R1,972 Discovery Miles 19 720 Ships in 10 - 15 working days

The rapid growth of the use of optoelectronic technology in Information and Communications Technology (ICT) has seen a complementary increase in the performance of such technologies. As a result, optoelectronic technologies have replaced the technology of electronic interconnections. However, the control of manufacturing techniques for optoelectronic systems is more delicate than that of microelectronic technologies. This practical resource, divided into four chapters, examines several methods for determining the reliability of infrared LED devices. The primary interest of this book focuses on methods of extracting fundamental parameters from the electrical and optical characterization of specific zones in components. Failure mechanisms are identified based on measured performance before and after aging tests. Knowledge of failure mechanisms allows formulation of degradation laws, which in turn allow an accurate lifetime distribution for specific devices to be proposed.

Reliability Investigation of LED Devices for Public Light Applications (Hardcover): Raphael Baillot, Yannick Deshayes Reliability Investigation of LED Devices for Public Light Applications (Hardcover)
Raphael Baillot, Yannick Deshayes
R1,688 Discovery Miles 16 880 Ships in 10 - 15 working days

Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications. Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models. The proposed technology and methodologies will help those interested in the topic to further their knowledge of failure mechanisms, exploring the physical and chemical analyses involved.

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