Offering engineers and material scientists an explanation of the complex interrelations between numerous lightweight construction methods, this book is didactically structured to cover the spectrum from determining requirements, to calculations and optimization, via component developments and choice of materials, right up to design and manufacturing techniques. Examples from transportation and racing illustrate the methods and interdependencies between the choice of material and design.

The Eide text has been a best seller in the introductory/freshman engineering market since it came out in 1979. It has always been known for its reliable and principles-based focus. In this edition, careful updating of the homework problems along with an earlier treatment of design will make this a favorite again.

Even in a course area that increasingly requires a variety of module books as well as broad unifying texts, this title is always considered for the first engineering course. For those instructors who do want Eides fundamentals approach but desire a shorter text to complement other application specific texts, McGraw-Hill offers the BEST version of this text as well. Please see Eides Introduction to Engineering Design and Problem Solving, 2nd edition, from the BEST series.

This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology "building blocks" used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual "building blocks" and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These "building blocks" are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Gives students a solid foundation in communication technology!

Moire fringe techniques have expanded considerably over the past decade and are now established as important metrological tools. The main reason for this flourishing expansion is the use of the moire fringe method in the common availability of the laser light. This book covers the major theoretical aspects and applications of the moire technique. A concise description of the formation of moire fringes and their interpretation is presented. A comprehensive review of the most important applications of the moire phenomenon is given. Although some of them are still being refined there are already well established applications to moire displacement and alignment sensors, grating interferometry, moire processing of interferograms, moire topography and strain analysis. There is also a discussion on the influence of the types of superimposition on structures and of the type of illumination used on the intensity distribution in moire patterns. An understanding of moire fringes and of the characteristics of moire patterns, which depend on various optical configurations, is essential for the proper use and control of moire methods. The physical and practical attributes of each technique are clarified throughout. The book will prove most appropriate in meeting the needs of newcomers to the field, as well as those of researchers and technicians who want to acquire a broader view and assessment of particular techniques.