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Books > Professional & Technical > Mechanical engineering & materials
Vibration and noise are two interrelated terms in the field of
mechanical engineering. Vibration is caused by unbalanced inertial
forces and moments whereas noise is the result of such vibrations.
Noisy machines have always been a matter of concern. Lesser
vibration ensures manufacturing to closer tolerances, lesser wear
and tear, and longer fatigue life. Hence, a quieter machine is more
cost-effective in the long run. It is now well understood that a
quieter machine is in every way a better machine.This book deals
with such industrial and automotive noise and vibration, their
measurement and control. This textbook stresses on physical
concepts and the application thereof to practical problems. The
author's four decades of experience in teaching, research and
industrial consultancy is reflected in the choice of the solved
examples and unsolved problems.The book targets senior
undergraduate students in mechanical engineering as well as
designers of industrial machinery and layouts. It can readily be
used for self-study by practicing designers and engineers.
The authors explain the changes in the thermophysical and
thermomechanical properties of polymer composites under elevated
temperatures and fire conditions. Using microscale physical and
chemical concepts they allow researchers to find reliable solutions
to their engineering needs on the macroscale. In a unique
combination of experimental results and quantitative models, a
framework is developed to realistically predict the behavior of a
variety of polymer composite materials over a wide range of thermal
and mechanical loads. In addition, the authors treat extreme fire
scenarios up to more than 1000?C for two hours, presenting
heat-protection methods to improve the fire resistance of composite
materials and full-scale structural members, and discuss their
performance after fire exposure.Thanks to the microscopic approach,
the developed models are valid for a variety of polymer composites
and structural members, making this work applicable to a wide
audience, including materials scientists, polymer chemists,
engineering scientists in industry, civil engineers, mechanical
engineers, and those working in the industry of civil
infrastructure.
Heterogeneous catalysts are an important tool for greener catalytic
processes due to the ease of their removal from the reaction
mixture and feasibility of reuse. When these catalysts can operate
in the ideal green solvent, water, they improve the sustainability
of the process. This book explores aqueous mediated heterogeneous
catalysts and their use in synthesis. Topics covered include
nanomaterials, quantum dots, metal organic frameworks, and their
use as catalysts.
How do you protect electrical systems from high energy
electromagnetic pulses? This book is designed for researchers who
wish to design toughned systems against EMPs from high altitude
sources. It discusses numerous factors affecting the strength of
EMPs as well as their impact on electronic components, devices and
power electrical equipment. This book includes practical protection
methods and means for evaluating their effectiveness.
This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3,
please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal
Packaging Applications /remove Thermal and mechanical packaging -
the enabling technologies for the physical implementation of
electronic systems - are responsible for much of the progress in
miniaturization, reliability, and functional density achieved by
electronic, microelectronic, and nanoelectronic products during the
past 50 years. The inherent inefficiency of electronic devices and
their sensitivity to heat have placed thermal packaging on the
critical path of nearly every product development effort in
traditional, as well as emerging, electronic product
categories.Successful thermal packaging is the key differentiator
in electronic products, as diverse as supercomputers and cell
phones, and continues to be of pivotal importance in the refinement
of traditional products and in the development of products for new
applications. The Encyclopedia of Thermal Packaging, compiled in
four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2:
Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and
Set 4: Thermal Packaging Configurations) will provide a
comprehensive, one-stop treatment of the techniques, tools,
applications, and configurations of electronic thermal packaging.
Each of the author-written sets presents the accumulated wisdom and
shared perspectives of a few luminaries in the thermal management
of electronics.Set 2: Thermal Packaging ToolsThe second set in the
encyclopedia, Thermal Packaging Tools, includes volumes dedicated
to thermal design of data centers, techniques and models for the
design and optimization of heat sinks, the development and use of
reduced-order "compact" thermal models of electronic components, a
database of critical material thermal properties, and a
comprehensive exploration of thermally-informed electronic design.
The numerical and analytical techniques described in these volumes
are among the primary tools used by thermal packaging practitioners
and researchers to accelerate product and system development and
achieve "correct by design" thermal packaging solutions.The four
sets in the Encyclopedia of Thermal Packaging will provide the
novice and student with a complete reference for a quick ascent on
the thermal packaging ';learning curve,'; the practitioner with a
validated set of techniques and tools to face every challenge, and
researchers with a clear definition of the state-of-the-art and
emerging needs to guide their future efforts. This encyclopedia
will, thus, be of great interest to packaging engineers, electronic
product development engineers, and product managers, as well as to
researchers in thermal management of electronic and photonic
components and systems, and most beneficial to undergraduate and
graduate students studying mechanical, electrical, and electronic
engineering.
The title, "Laminated Composite Doubly-Curved Shell Structures.
Differential and Integral Quadrature. Strong Form Finite Elements"
illustrates the theme treated and the prospective followed during
the composition of the present work. The aim of this manuscript is
to analyze the static and dynamic behavior of thick and moderately
thick composite shells through the application of the Differential
Quadrature (DQ) method. The book is divided into two volumes
wherein the principal higher order structural theories are
illustrated in detail and the mechanical behavior of doubly-curved
structures are presented by several static and dynamic numerical
applications. In particular, the first volume is mainly
theoretical, whereas the second one is mainly related to the
numerical DQ technique and its applications in the structural
field. The numerical results reported in the present volume are
compared to the one available in the literature, but also to the
ones obtained through several codes based on the Finite Element
Method (FEM). Furthermore, an advanced version of the DQ method,
termed Strong Formulation Finite Element Method (SFEM), is
presented. The SFEM solves the differential equations inside each
element in the strong form and implements the mapping technique
typical of the FEM.
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