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Three Dimensional System Integration - IC Stacking Process and Design (Hardcover, 2011 ed.)
Loot Price: R1,692
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Three Dimensional System Integration - IC Stacking Process and Design (Hardcover, 2011 ed.)
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Total price: R1,712
Discovery Miles: 17 120
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Three-dimensional (3D) integrated circuit (IC) stacking is the next
big step in electronic system integration. It enables packing more
functionality, as well as integration of heterogeneous materials,
devices, and signals, in the same space (volume). This results in
consumer electronics (e.g., mobile, handheld devices) which can run
more powerful applications, such as full-length movies and 3D
games, with longer battery life. This technology is so promising
that it is expected to be a mainstream technology a few years from
now, less than 10-15 years from its original conception. To achieve
this type of end product, changes in the entire manufacturing and
design process of electronic systems are taking place. This book
provides readers with an accessible tutorial on a broad range of
topics essential to the non-expert in 3D System Integration. It is
an invaluable resource for anybody in need of an overview of the 3D
manufacturing and design chain.
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