Design for Manufacturability - From 1D to 4D for 90-22 nm Technology Nodes (Paperback, Softcover reprint of the original 1st ed. 2014)

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	August 2016
First published:	2014
Authors:	Artur Balasinski
Dimensions:	235 x 155 x 15mm (L x W x T)
Format:	Paperback
Pages:	278
Edition:	Softcover reprint of the original 1st ed. 2014
ISBN-13:	978-1-4939-4342-5
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Production engineering > Reliability engineering Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	1-4939-4342-1
Barcode:	9781493943425

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