|
Books > Professional & Technical > Mechanical engineering & materials
|
Buy Now
Encyclopedia of Thermal Packaging - Set 3: Thermal Packaging Applications: (A 3-Volume Set) (Hardcover)
Loot Price: R42,337
Discovery Miles 423 370
|
|
|
Encyclopedia of Thermal Packaging - Set 3: Thermal Packaging Applications: (A 3-Volume Set) (Hardcover)
Expected to ship within 12 - 19 working days
|
Thermal and mechanical packaging - the enabling technologies for
the physical implementation of electronic systems - are responsible
for much of the progress in miniaturization, reliability, and
functional density achieved by electronic, microelectronic, and
nanoelectronic products during the past 50 years. The inherent
inefficiency of electronic devices and their sensitivity to heat
have placed thermal packaging on the critical path of nearly every
product development effort in traditional, as well as emerging,
electronic product categories. Successful thermal packaging is the
key differentiator in electronic products, as diverse as
supercomputers and cell phones, and continues to be of pivotal
importance in the refinement of traditional products and in the
development of products for new applications. The Encyclopedia of
Thermal Packaging, compiled in four multi-volume sets (Set 1:
Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set
3: Thermal Packaging Applications, and Set 4: Thermal Packaging
Configurations) provides a comprehensive, one-stop treatment of the
techniques, tools, applications, and configurations of electronic
thermal packaging. Each of the author-written volumes presents the
accumulated wisdom and shared perspectives of a few luminaries in
the thermal management of electronics. The four sets in the
Encyclopedia of Thermal Packaging will provide the novice and
student with a complete reference for a quick ascent on the thermal
packaging "learning curve," the practitioner with a validated set
of techniques and tools to face every challenge, and researchers
with a clear definition of the state-of-the-art and emerging needs
to guide their future efforts. This encyclopedia will, thus, be of
great interest to packaging engineers, electronic product
development engineers, and product managers, as well as to
researchers in thermal management of electronic and photonic
components and systems, and most beneficial to undergraduate and
graduate students studying mechanical, electrical, and electronic
engineering. Set 3: Thermal Packaging Applications The third set in
the Encyclopedia includes two volumes in the planned focus on
Thermal Packaging Applications and a single volume on the use of
Phase Change Materials (PCM), a most important Thermal Management
Technique, not previously addressed in the Encyclopedia. Set 3
opens with Heat Transfer in Avionic Equipment, authored by Dr Boris
Abramzon, offering a comprehensive, in-depth treatment of compact
heat exchangers and cold plates for avionics cooling, as well as
discussion on recent developments in these heat transfer units that
are widely used in the thermal control of military and civilian
airborne electronics. Along with a detailed presentation of the
relevant thermofluid physics and governing equations, and the
supporting mathematical design and optimization techniques, the
book offers a practical guide for thermal engineers designing
avionics cooling equipment, based on the author's 20+ years of
experience as a thermal analyst and a practical design engineer for
Avionics and related systems. The Set continues with Thermal
Management of RF Systems, which addresses sequentially the history,
present practice, and future thermal management strategies for
electronically-steered RF systems, in the context of the RF
operational requirements, as well as device-, module-, and
system-level electronic, thermal, and mechanical considerations.
This unique text was written by 3 authors, Dr John D Albrecht, Mr
David H Altman, Dr Joseph J Maurer, with extensive US Department of
Defense and aerospace industry experience in the design,
development, and fielding of RF systems. Their combined efforts
have resulted in a text, which is well-grounded in the relevant
past, present, and future RF systems and technologies. Thus, this
volume will provide the designers of advanced radars and other
electronic RF systems with the tools and the knowledge to address
the thermal management challenges of today's technologies, as well
as of advanced technologies, such as wide bandgap semiconductors,
heterogeneously integrated devices, and 3D chipsets and stacks. The
third volume in Set 3, Phase Change Materials for Thermal
Management of Electronic Components, co-authored by Prof Gennady
Ziskind and Dr Yoram Kozak, provides a detailed description of the
numerical methods used in PCM analysis and a detailed explanation
of the processes that accompany and characterize solid-liquid
phase-change in popular basic and advanced geometries. These
provide a foundation for an in-depth exploration of specific
electronics thermal management applications of Phase Change
Materials. This volume is anchored in the unique PCM knowledge and
experience of the senior author and placed in the context of the
extensive solid-liquid phase-change literature in such diverse
fields as material science, mathematical modeling, experimental and
numerical methods, and thermofluid science and engineering.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
You might also like..
|
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
