This book focuses on foundry-based process technology that
enables the fabrication of 3-D ICs. The core of the book discusses
the technology platform for pre-packaging wafer lever 3-D ICs.
However, this book does not include a detailed discussion of 3-D
ICs design and 3-D packaging. This is an edited book based on
chapters contributed by various experts in the field of wafer-level
3-D ICs process technology. They are from academia, research labs
and industry.
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