Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys (R) (Hardcover, 2003 ed.)

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(r) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS(r) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS(r) to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(r) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packag

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	The Springer International Series in Engineering and Computer Science, 719
Release date:	December 2002
First published:	2003
Authors:	Erdogan Madenci • Ibrahim Guven • Bahattin Kilic
Dimensions:	235 x 155 x 12mm (L x W x T)
Format:	Hardcover
Pages:	185
Edition:	2003 ed.
ISBN-13:	978-1-4020-7330-4
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
LSN:	1-4020-7330-5
Barcode:	9781402073304

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