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Microelectronic Interconnections and Assembly - Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996 (Hardcover)
Loot Price: R2,570
Discovery Miles 25 700
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Microelectronic Interconnections and Assembly - Proceedings of the NATO Advanced Research Workshop, Prague, Czech Republic, 18-21 May 1996 (Hardcover)
Series: NATO Science Partnership Subseries 3: High Technology, v. 54
Expected to ship within 12 - 17 working days
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Total price: R2,590
Discovery Miles: 25 900
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This text covers the proceedings of the NATO Advanced Research
Workshop which is devoted to the technical aspects of advanced
interconnections and microassembly and also includes papers on the
education issues needed to prepare students for work in these
areas. The future direction that such technologies may take is also
dealt with. The basic issue is that the miniaturization of
electronic systems continues, and performance must continue to
improve. The newest packages are often based on the selection of an
appropriate interconnection method. Advances in chip-scale,
chip-flip, and direct chip attachments are described. Although wire
bonding currently dominates the market, the consensus is that flip
chip interconnection will rapidly increase its market share. Tape
automated bonding is also discussed, primarily for special
applications. Solder metallurgy and flip chip production technology
receive attention in several papers. Solderability, reliability and
fatigue of the joints are modelled, and mechanical stresses
resulting from temperature cycling are reported. Multichip module
and thick-film hybrid substrate interconnections are reported in
several papers. These include thick and thin film metals, as well
as low temperature polymer inks. Several papers describe diffusion
and other metallurgical interactions in thick film surfaces.
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