Advanced Thermal Management Materials (Hardcover, 2013 ed.)

"Advanced Thermal Management Materials" provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional, with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	September 2012
First published:	2013
Authors:	Guosheng Jiang • Liyong Diao • Ken Kuang
Dimensions:	235 x 155 x 11mm (L x W x T)
Format:	Hardcover
Pages:	156
Edition:	2013 ed.
ISBN-13:	978-1-4614-1962-4
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > Engineering thermodynamics Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
LSN:	1-4614-1962-X
Barcode:	9781461419624

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