Rapid Thermal Processing for Future Semiconductor Devices (Paperback)

This volume is a collection of papers which were presented at the 2001 International Conference on Rapid Thermal Processing (RTP 2001) held at Ise Shima, Mie, on November 14-16, 2001. This symposium is second conference followed the previous successful first International RTP conference held at Hokkaido in 1997. The RTP 2001 covered the latest developments in RTP and other short-time processing continuously aiming to point out the future direction in the Silicon ULSI devices and II-VI, III-V compound semiconductor devices.
This book covers the following areas: advanced MOS gate stack, integration technologies, advancd channel engineering including shallow junction, SiGe, hetero-structure, novel metallization, inter-connect, silicidation, low-k materials, thin dielectrics including gate dielectrics and high-k materials, thin film deposition including SiGe, SOI and SiC, process and device modelling, Laser-assisted crystallization and TFT device fabrication technologies, temperature monitoring and slip-free technologies.

General

Imprint:	Elsevier Science Ltd
Country of origin:	United Kingdom
Release date:	April 2003
First published:	April 2003
Authors:	H. Fukuda
Dimensions:	234 x 156 x 9mm (L x W x T)
Format:	Paperback
Pages:	160
ISBN-13:	978-0-444-51339-7
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors Books > Academic & Education > Professional & Technical > Physics Promotions
LSN:	0-444-51339-6
Barcode:	9780444513397

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