Heat transfer is one of the most common physical phenomena. Most
devices include heat sources and heat exchange with the
environment. The problem of thermal management has become essential
in many industrial sectors. It especially impacts the electronics
industry for many years due to the increasing density of
components. Thereby, the effects of significant overheating during
thermal cycling in electronic components are numerous and affect
both the reliability and durability of components and power
circuits, compromising the operation and safety of complex systems.
Furthermore, the sharing of a common thermal environment
increasingly restricted by several heat sources makes the thermal
coupling between critical and unpredictable components especially
as cooling paths can be multiple. With regards to engineering heat
transfer, this book discussed the applied thermal process, the work
on the temperature control component. The research objects are
addressed experimentally and numerically and lead to innovative
design, also made in laboratory. The design of engineering project
and development of model for heat transfer process are also carried
out on this book to enable the study of systems and to optimize the
design.
General
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