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Semiconductor Device Physics and Simulation (Paperback, Softcover reprint of the original 1st ed. 1998) Loot Price: R4,277
Discovery Miles 42 770
Semiconductor Device Physics and Simulation (Paperback, Softcover reprint of the original 1st ed. 1998): J.S. Yuan, Juin Jei...

Semiconductor Device Physics and Simulation (Paperback, Softcover reprint of the original 1st ed. 1998)

J.S. Yuan, Juin Jei Liou

Series: Microdevices

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Loot Price R4,277 Discovery Miles 42 770 | Repayment Terms: R401 pm x 12*

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The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Microdevices
Release date: June 2013
First published: 1998
Authors: J.S. Yuan • Juin Jei Liou
Dimensions: 254 x 178 x 18mm (L x W x T)
Format: Paperback
Pages: 336
Edition: Softcover reprint of the original 1st ed. 1998
ISBN-13: 978-1-4899-1906-9
Categories: Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
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LSN: 1-4899-1906-6
Barcode: 9781489919069

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