Nanopackaging - Nanotechnologies and Electronics Packaging (Hardcover, 2009)

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	October 2008
First published:	October 2008
Editors:	James E. Morris
Dimensions:	235 x 155 x 31mm (L x W x T)
Format:	Hardcover
Pages:	543
Edition:	2009
ISBN-13:	978-0-387-47325-3
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
LSN:	0-387-47325-4
Barcode:	9780387473253

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