Lead-free solders are used extensively as interconnection
materials in electronic assemblies and play a critical role in the
global semiconductor packaging and electronics manufacturing
industry. Electronic products such as smart phones, notebooks and
high performance computers rely on lead-free solder joints to
connect IC chip components to printed circuit boards." Lead Free
Solder: Mechanics and Reliability" provides in-depth design
knowledge on lead-free solder elastic-plastic-creep and strain-rate
dependent deformation behavior and its application in failure
assessment of solder joint reliability. It includes coverage of
advanced mechanics of materials theory and experiments, mechanical
properties of solder and solder joint specimens, constitutive
models for solder deformation behavior; numerical modeling and
simulation of solder joint failure subject to thermal cycling,
mechanical bending fatigue, vibration fatigue and board-level drop
impact tests.
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