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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
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Lead Free Solder - Mechanics and Reliability (Paperback, 2012 ed.)
Loot Price: R3,431
Discovery Miles 34 310
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Lead Free Solder - Mechanics and Reliability (Paperback, 2012 ed.)
Expected to ship within 10 - 15 working days
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Lead-free solders are used extensively as interconnection materials
in electronic assemblies and play a critical role in the global
semiconductor packaging and electronics manufacturing industry.
Electronic products such as smart phones, notebooks and high
performance computers rely on lead-free solder joints to connect IC
chip components to printed circuit boards. Lead Free Solder:
Mechanics and Reliability provides in-depth design knowledge on
lead-free solder elastic-plastic-creep and strain-rate dependent
deformation behavior and its application in failure assessment of
solder joint reliability. It includes coverage of advanced
mechanics of materials theory and experiments, mechanical
properties of solder and solder joint specimens, constitutive
models for solder deformation behavior; numerical modeling and
simulation of solder joint failure subject to thermal cycling,
mechanical bending fatigue, vibration fatigue and board-level drop
impact tests.
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