Welcome to Loot.co.za! Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search

Checkout
- Your Cart Price

Your cart

Your cart is empty

Books > Professional & Technical > Industrial chemistry & manufacturing technologies

Buy Now

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.) Loot Price: R4,753

Discovery Miles 47 530

Repayment Terms: R445 pm x 12*

Add to cart

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.): John W. Balde

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.)

John W. Balde

Series: Emerging Technology in Advanced Packaging, 1

(sign in to rate)

Loot Price R4,753 Discovery Miles 47 530 | Repayment Terms: R445 pm x 12*

Expected to ship within 12 - 19 working days

Description
Details
Customer Reviews

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

General

Imprint:	Springer
Country of origin:	Netherlands
Series:	Emerging Technology in Advanced Packaging, 1
Release date:	2003
First published:	2003
Editors:	John W. Balde
Dimensions:	235 x 155 x 22mm (L x W x T)
Format:	Hardcover
Pages:	347
Edition:	2003 ed.
ISBN-13:	978-0-7923-7676-7
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Promotions
LSN:	0-7923-7676-5
Barcode:	9780792376767