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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.) Loot Price: R4,210
Discovery Miles 42 100
Repayment Terms: R395 pm x 12*
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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.): John W. Balde

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Hardcover, 2003 ed.)

John W. Balde

Series: Emerging Technology in Advanced Packaging, 1

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Loot Price R4,210 Discovery Miles 42 100 | Repayment Terms: R395 pm x 12*

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

General

Imprint: Springer
Country of origin: Netherlands
Series: Emerging Technology in Advanced Packaging, 1
Release date: 2003
First published: 2003
Editors: John W. Balde
Dimensions: 235 x 155 x 22mm (L x W x T)
Format: Hardcover
Pages: 347
Edition: 2003 ed.
ISBN-13: 978-0-7923-7676-7
Categories: Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
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LSN: 0-7923-7676-5
Barcode: 9780792376767

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