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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module - Ceramic research and development in Japan (Hardcover, English language ed) Loot Price: R7,769
Discovery Miles 77 690
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module - Ceramic research and development in Japan...

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module - Ceramic research and development in Japan (Hardcover, English language ed)

K. Otsuka

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Loot Price R7,769 Discovery Miles 77 690 | Repayment Terms: R728 pm x 12*

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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

General

Imprint: Kluwer Academic Publishers
Country of origin: Netherlands
Release date: April 1993
First published: 1993
Authors: K. Otsuka
Dimensions: 254 x 178 x 16mm (L x W x T)
Format: Hardcover
Pages: 242
Edition: English language ed
ISBN-13: 978-1-85166-579-2
Categories: Books > Computing & IT > General theory of computing > General
Books > Computing & IT > Applications of computing > General
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Ceramics & glass technology
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LSN: 1-85166-579-X
Barcode: 9781851665792

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