This volume documents the proceedings of the "Second
International Symposium on Polyimides and Other High Temperature
Polymers: Synthesis, Characterization and Applications, held in
Newark, New Jersey, December 3-6, 2001.
Polyimides possess many desirable attributes, so this class of
materials has found applications in many technologies ranging from
microelectronics to high temperature adhesives to membranes.
This volume contains a total of 32 papers, all rigorously peer
reviewed and revised before inclusion, addressing many aspects and
new developments in polyimides and other high temperature polymers.
The book is divided into two parts: Synthesis, Properties and Bulk
Characterization and Surface Modification, Interfacial or Adhesion
Aspects and Applications.
The topics covered include: synthesis and characterization of a
variety of polyimides; photoalignable polyimides; high-modulus
poly(p-phenylenepyromellitimide) films; structure-property
relationships in polyimides; aromatic benzoxazole polymers;
polybenzobisthiazoles; polyimide L-B films; transport of water in
high Tg polymers; surface modification of polyimides; adhesion of
metal films to polyimide and other polymers; investigation of
interfacial interactions between metals and polymers; polyimide
film surface properties; applications of polyimides in
microelectronics, as membranes for gas separation, as composite
films; fabrication of thin-film transistors on polyimide films;
polyimide modified with fullerenes; semicrystalline polyimides for
advanced composites; and wear performance of polyetherimide
composite.
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