MEMS/MOEM Packaging (Hardcover)

. This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including: . Wafer-level packaging. Microfluidic device packaging. Optical MEMS packaging. RF and microwave packaging. Laser sealing.

. Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues..

. CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING And ASSEMBLY PROBLEMS:
. Engineering fundamentals of packaging for MEMS and MOEMS devices. Principles, materials, and fabrication of MEMS and MOEMS devices. Evaluation methods for MEMS and MOEMS packaging challenges. MEMS packaging processes. From MEMS and MOEMS to nanotechnology. . . . . .

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