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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation (Paperback) Loot Price: R1,071
Discovery Miles 10 710
Repayment Terms: R100 pm x 12*
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation (Paperback):...

New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation (Paperback)

Nabil Shovon Ashraf, Shawon Alam, Mohaiminul Alam

Series: Synthesis Lectures on Emerging Engineering Technologies

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Loot Price R1,071 Discovery Miles 10 710 | Repayment Terms: R100 pm x 12*

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In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

General

Imprint: Springer International Publishing AG
Country of origin: Switzerland
Series: Synthesis Lectures on Emerging Engineering Technologies
Release date: February 2016
First published: 2016
Authors: Nabil Shovon Ashraf • Shawon Alam • Mohaiminul Alam
Dimensions: 235 x 191mm (L x W)
Format: Paperback
Pages: 72
ISBN-13: 978-3-03-100899-3
Languages: English
Subtitles: English
Categories: Books > Professional & Technical > Technology: general issues > Engineering: general
Books > Computing & IT > Computer hardware & operating systems > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN: 3-03-100899-5
Barcode: 9783031008993

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