Handbook of 3D Integration Volume 1 and 2 - Technology and Applications of 3D Integrated Circuits (Paperback)

The first encompassing treatise of this new and very important field puts the known physical limitations for classic 2D microelectronics into perspective with the requirements for further microelectronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The editors have assembled contributions from key academic and industrial players in the field, including Intel, Micron, IBM, Infineon, Qimonda, NXP, Philips, Toshiba, Semitool, EVG, Tezzaron, Lincoln Labs, Fraunhofer, RPI, IMEC, CEA-LETI and many others.

General

Imprint:	Wiley-VCH Verlag GmbH
Country of origin:	Germany
Release date:	September 2012
First published:	October 2012
Authors:	P. Garrou
Dimensions:	238 x 170 x 40mm (L x W x T)
Format:	Paperback
Pages:	799
ISBN-13:	978-3-527-33265-6
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	3-527-33265-0
Barcode:	9783527332656

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